Chip type solid electrolytic capacitor

Details Chip type solid electrolytic capacitor Chip type solid electrolytic capacitor

2001-11-13

2003-01-14

Reichard, Dean A. (Department: 2831)

Electricity: electrical systems and devices

Electrolytic systems or devices

Solid electrolytic capacitor

C361S532000, C361S528000

Reexamination Certificate

active

06507482

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a chip type solid electrolytic capacitor, and more particularly to a shape of a resin block entirely covering a solid electrolytic capacitor device in a solid electrolytic capacitor.
2. Description of the Related Art
FIG. 1
is a cross-sectional view of a conventional chip type solid electrolytic capacitor.
As illustrated in
FIG. 1
, the conventional chip type solid electrolytic capacitor
30
is comprised of a chip type solid electrolytic capacitor device
31
, a resin block
32
entirely covering the chip type solid electrolytic capacitor device
31
therewith, and a pair of electrodes
33
a
and
33
b
both electrically connected to the chip type solid electrolytic capacitor
31
and extending outwardly of the resin block
32
.
An anode
34
extends outwardly from the chip type solid electrolytic capacitor device
31
to thereby electrically connect the chip type solid electrolytic capacitor device
31
and the electrode
33
a
to each other therethrough. The electrode
33
b
is electrically connected to the chip type solid electrolytic capacitor device
31
through solder
35
.
The electrodes
33
a
and
33
b
have L-shaped bends, and further have a distal end located just beneath a bottom surface
32
a
of the resin block
32
.
The resin block
32
is formed centrally with a raised portion
36
extending downwardly from the bottom surface
32
a
of the resin block
32
, in order to prevent the chip type solid electrolytic capacitor device
31
from being exposed externally. The raised portion
36
has a rectangular cross-section, and has a height not beyond lower surfaces of the electrodes
33
a
and
33
b.
However, the raised portion
36
may have a height beyond the lower surfaces of the electrodes
33
a
and
33
b.
As illustrated in
FIG. 1
, since the chip type solid electrolytic capacitor device
31
includes the anode
34
, a center of the chip type solid electrolytic capacitor device
31
is deviated towards the right in
FIG. 1
from a center of the resin block
32
by L/2 where L indicates a length of a portion of the anode
34
exposed out of the chip type solid electrolytic capacitor device
31
. In other words, the chip type solid electrolytic capacitor device
31
is deviated towards a cathode (not illustrated) in the resin block
32
.
As mentioned earlier, the raised portion
36
is formed centrally of the bottom surface
32
a
of the resin block
32
on the assumption that the chip type solid electrolytic capacitor device
31
is located centrally of the resin block
32
.
Accordingly, if the chip type solid electrolytic capacitor device
31
were deviated towards a cathode in the resin block
32
, there is caused a problem as follows.
As illustrated in
FIG. 2
, if the chip type solid electrolytic capacitor device
31
were mounted in the resin block
32
with being inclined obliquely, a corner
31
a
of the chip type solid electrolytic capacitor device
31
cannot be covered with the raised portion
36
, resulting in that the corner
31
a
might be exposed outwardly of the bottom surface
32
a
of the resin block
32
at a place where the raised portion
36
is not formed.
The above-mentioned problem is caused also when the chip type solid electrolytic capacitor device
31
is larger in size than the resin block
32
and therefore the raised portion
36
.
Japanese Unexamined Utility Model Publication No. 59-151424 has suggested a chip type electronic part including a device, a resin block covering the device therewith, and electrodes extending outwardly of the resin block to be electrically connected to a circuit by face-bonding. The resin block is formed at a bottom surface thereof with a raised portion extending downwardly to face the circuit. The chip type electronic part can stand by itself by virtue of the raised portion.
Japanese Unexamined Utility Model Publication No. 1-110424 has suggested a chip type capacitor including an electronic device, a resin block entirely covering the electronic device therewith, and metal terminals extending from the electronic device and bending towards the resin block to thereby be level with a bottom surface of the resin block.
Japanese Unexamined Patent Publication No. 8-125061 has suggested a semiconductor device including an electronic part, a resin block covering the electronic part therewith and having a surface from which a plurality of pins extend vertically, a pin protector having a part holder which holds the electronic part at a predetermined position in a holder space, the pin protector having a surface formed with a first hole through which the pins are exposed, and further having another surface a second hole through which the pin projects with the resin block making contact with an inner wall of the first hole, thereby allowing the pin to be inserted into a hole formed through a wiring substrate.
Japanese Unexamined Patent Publication No. 9-298256 has suggested an electronic part including an electronic device, a lead electrically connected to the electronic device, and a resin block covering the electronic device and the lead therewith. A side surface of the lead is formed at a lower end of a side surface of the resin block when the side surface of the resin block is cut out, and is exposed in the same plane with the side surface of the resin block.
However, the above-mentioned problem remains unsolved even in those Publications.
SUMMARY OF THE INVENTION
In view of the above-mentioned problem in the prior art, it is an object of the present invention to provide a chip type solid electrolytic capacitor and a structure for mounting an electronic part both of which can prevent a chip type solid electrolytic capacitor device, in particular, a corner thereof from being exposed outwardly of a resin block, even when the chip type solid electrolytic capacitor device is loaded in the resin block with being obliquely inclined.
In one aspect of the present invention, there is provided a structure for mounting an electronic part, including (a) an electronic part in the form of a chip, (b) a resin block entirely covering the electronic part therewith, and (c) a pair of electrodes electrically connected to the electronic part and extending outwardly of the resin block, the electronic part being deviated in position in a direction relative to a center of the structure, the resin block being formed with a raised portion extending downwardly from a bottom surface of the resin block, the resin block having a tapered portion between a top surface of the raised portion and the bottom surface of the resin block in the direction.
In the above-mentioned structure, the resin block is designed to have a tapered portion between a top surface of the raised portion (corresponding to the raised portion
36
in
FIG. 1
) and a bottom surface (corresponding to the bottom surface
32
a
of the resin block
32
in
FIG. 1
) of the resin block. Accordingly, even if a chip type electronic part is mounted in the resin block with being obliquely inclined, a corner (corresponding to the corner
31
a
in
FIG. 2
) of the chip type electronic part remains shielded in the tapered portion of the resin block, preventing that the chip type electronic part is exposed outwardly of the resin block.
There is further provided a structure for mounting an electronic part, including (a) an electronic part in the form of a chip, (b) a resin block entirely covering the electronic part therewith, and (c) a pair of electrodes electrically connected to the electronic part and extending outwardly of the resin block, the electronic part being deviated in position in a direction relative to a center of the structure, the resin block being formed with a raised portion extending downwardly from a bottom surface of the resin block, the raised portion having a length beyond an end of the electronic part in the direction.
In the above-mentioned structure, the raised portion (corresponding to the raised portion
36
in
FIG. 1
) is designed to have a length beyond an end of the electro

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