Chip-type piezoelectric-resonator and method of manufacturing th

Details Chip-type piezoelectric-resonator and method of manufacturing th Chip-type piezoelectric-resonator and method of manufacturing th

1996-01-25

1997-04-22

Lee, Benny

Wave transmission lines and networks

Coupling networks

Electromechanical filter

310340, 310344, 29 2535, H03H 900

Patent

active

056232365

ABSTRACT:
In order to regularly properly define cavities for vibrating spaces in a chip-type piezoelectric-resonator which is protected with resin to be capable of surface mounting, a mother substrate comprising a piezoelectric substrate, a plurality of piezoelectric resonance elements formed thereon is prepared and bank-shaped adhesive layers are formed on respective major surfaces of the mother substrate to enclose the vibrating region, and mother sheets provided with plural cover sheets are arranged to cover both major surfaces of the mother substrate, thereby defining cavities for vibrating spaces. Then, protective resin members are applied to cover both major surfaces of the mother substrate, which in turn is divided to obtain a plurality of chip-type piezoelectric-resonators.

REFERENCES:
patent: 5192925 (1993-03-01), Kaida
patent: 5304980 (1994-04-01), Yoshinaga et al.
patent: 5357662 (1994-10-01), Takagi et al.

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