Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate
2011-07-26
2011-07-26
Tran, Minh-Loan T (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With reflector, opaque mask, or optical element integral...
C257SE33061
Reexamination Certificate
active
07985980
ABSTRACT:
In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.
REFERENCES:
patent: 2005/0280017 (2005-12-01), Oshio et al.
patent: 7-235696 (1995-09-01), None
patent: 2001-160629 (2001-06-01), None
patent: 2006-190764 (2006-07-01), None
Hata Toshio
Matsuda Makoto
Morrison & Foerster / LLP
Quinto Kevin
Sharp Kabushiki Kaisha
Tran Minh-Loan T
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