Chip type directional coupler comprising a laminated structure

Wave transmission lines and networks – Plural channel systems – Having branched circuits

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333246, H01P 518

Patent

active

053693795

ABSTRACT:
Disclosed herein is a chip type directional coupler comprising a laminated structure of a plurality of dielectric substrates, each dielectric substrate having a pair of stripline electrodes nonlinearly formed on its one major surface in parallel with each other, and a plurality of ground electrode substrates, each ground electrode substrate being provided with a ground electrode on its one major surface, the dielectric and ground electrode substrates being so alternately stacked that uppermost and lowermost layers are defined by the ground electrodes, and a plurality of external electrodes which are formed on side surfaces of the laminated structure. The pairs of stripline electrodes formed on the respective dielectric substrates are connected in series with each other through the intervening dielectric substrates, to define stripline electrodes of quarter wavelengths in overall length. Both ends of the quarter-wavelength stripline electrodes and the ground electrodes are electrically connected to different ones of the external electrodes.

REFERENCES:
patent: 4821007 (1989-04-01), Fields et al.
patent: 5032803 (1991-07-01), Koch

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