Chip-type composite part

Details Chip-type composite part Chip-type composite part

1993-08-13

1999-07-27

Yamnitzky, Marie

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428901, 428 68, 428201, 361738, 361782, 361811, B32B 300

Patent

active

059287667

ABSTRACT:
On the front surface of an insulating substrate, there are formed first and second terminal electrodes at one end portion of the substrate, a third terminal electrode at the other end portion, a resistor portion connected to the first and second terminal electrodes, and a capacitor portion connected to the second and third terminal electrodes. The capacitor portion has a multilayer structure consisting of a bottom electrode, dielectric layer and a top electrode.

REFERENCES:
patent: 4020222 (1977-04-01), Kausche et al.
patent: 4490429 (1984-12-01), Tosaki et al.
Sinnadurai, "Handbook of Microelec. Packaging and Interconnection Tech.," 1985, Electrochem. Publ., pp. 30-35, 92-95.
Towers, "Hybrid Microcircuits" Pentech Press, 1979, pp. 8-11, 76-79.

Affiliated with

Also associated with

Rating

Chip-type composite part does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip-type composite part, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip-type composite part will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-876657