Electrical resistors – Incased – embedded – or housed – Plural resistors
Patent
1996-06-27
1998-03-31
Wong, Peter S.
Electrical resistors
Incased, embedded, or housed
Plural resistors
338325, 338327, 338328, 338329, 338319, 338320, H01C 102, H01C 114
Patent
active
057343136
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a chip-type composite electronic component which comprises a common electrode, a plurality of individual electrode, and a plurality of electronic elements each interposed between each of the individual electrodes and the common electrode.
BACKGROUND ART
Examples of chip-type composite electronic components include a composite resistor incorporating a plurality of resistor elements, a composite capacitor incorporating a plurality of capacitor elements, and a composite diode incorporating a plurality of diode elements.
Of these, a typical composite resistor comprises a single substrate, a common electrode formed on the substrate, a plurality of individual electrodes formed on the substrate to be spaced from the common electrode, and a plurality of resistor elements (film-like resistor elements) each interposed between each of the individual electrodes and the common electrode. Each of the common electrode and individual electrodes includes a thick film layer of silver-palladium alloy, a nickel layer plated on the thick film layer, and a solder layer plated on the nickel layer.
With the prior art chip-type composite resistor having the above-described structure, the thickness of the nickel and solder layers of the common electrode increases at an extremely higher rate than the thickness of the nickel and solder layers of each, individual electrode as the resistance of the film-like resistor elements increases. This can be understood by referring to the "no agitator" column in the table shown in FIG. 7.
Specifically, the "no agitator" column in the FIG. 7 table shows, with respect to a multiplicity of prior art chip-type composite resistors for each of different resistance values of resistor elements, a ratio between the thickness (average) of the solder layers of the common electrodes and the thickness (average) of the solder layers of the individual electrodes. The table also shows a ratio between the thickness (average) of the nickel layers of the common electrodes and the thickness (average) of the nickel layers of the individual electrodes. According to the table, when the resistance of the resistor elements is 10K .OMEGA., the thickness of the solder layer of the common electrode is 2.20 times as great as the thickness of the solder layer of the individual electrodes, whereas the thickness of the nickel layer of the common electrode is 2.78 times as great as the thickness of the nickel layer of the individual electrodes. When the resistance of the resistor elements is 47K .OMEGA., the thickness of the solder layer of the common electrode is 3.04 times as great as the thickness of the solder layer of the individual electrodes, whereas the thickness of the nickel layer of the common electrode is 3.44 times as great as the thickness of the nickel layer of the individual electrodes. Further, when the resistance of the resistor elements is 100K .OMEGA., the thickness of the solder layer of the common electrode is 5.02 times as great as the thickness of the solder layer of the individual electrodes, whereas the thickness of the nickel layer of the common electrode is 4.29 times as great as the thickness of the nickel layer of the individual electrodes.
The above results are considered mainly attributable to the combination of the following two causes. First, in the process of plating nickel and solder layers, a multiplicity of chip-type composite resistors which are simultaneously plated will suffer great variations, from resistor to resistor, in the rate or speed of forming the nickel and solder layers. Thus, if the respective thickness of nickel and solder layers is adjusted to have a predetermined value with respect to composite resistors undergoing slower layer formation, the nickel and solder layers of other composite resistors undergoing faster layer formation will grow to have an excessively large thickness. Secondly, since the individual electrodes connected to the resistor elements having a large electrical resistance will suffer difficulty in formi
REFERENCES:
patent: 4829553 (1989-05-01), Shindo et al.
patent: 5285184 (1994-02-01), Hatta et al.
Doi Masato
Inoue Hirotoshi
Mitsuno Seiji
Rohm & Co., Ltd.
Shin K.
Wong Peter S.
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