Chip type component installation structure

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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Details

2281801, 2281802, 361406, 361409, H05K 0118

Patent

active

048839205

ABSTRACT:
In the chip type component installation structure wherein chips are arranged to be joined by solder to a fitting pattern provided on a printed substrate, resist films are set separately in the space of the fitting pattern in order to reduce the quantity of solder. The resist films are set in the space of the fitting pattern separately, so that the structure provides a lesser quantity of solder to join and fix chips, a continuous solder band over the fitting pattern, and a lesser but sufficient quantity of the solder. The structure prevents cracks and breakages of chips due to the expansion and contraction of solder, increases the polarity of solder against chips and electrodes, shortens the soldering time, and increases the reliability of chip installation work.

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