Chip-type capacitor, method of manufacturing the same and...

Electricity: electrical systems and devices – Electrolytic systems or devices – Solid electrolytic capacitor

Reexamination Certificate

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Details

C361S535000, C361S517000, C029S025030

Reexamination Certificate

active

06882521

ABSTRACT:
A chip-type capacitor includes a capacitor element, an encapsulation resin covering an entirety of the capacitor element, an anode terminal having a base portion whose bottom surface is exposed on a mounting surface of the encapsulation resin and a standing-up portion perpendicular to the base portion and having one end connected to the base portion and the other end welded to an anode lead wire led out from the capacitor element, and a cathode terminal fixed through a conductive adhesive to the capacitor element so as to expose a bottom surface on the mounting surface of the encapsulation resin. A depressed portion is formed on each of opposite side surfaces of the encapsulation resin, thereby partially exposing a top surface of each of the anode and the cathode terminals opposite to the bottom surface to form a terminal exposed portion exposed out of the encapsulation resin.

REFERENCES:
patent: 5638253 (1997-06-01), Hasegawa
patent: 6356431 (2002-03-01), Lin et al.
patent: 2001-291641 (2001-10-01), None
patent: 2002-43175 (2002-02-01), None

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