Chip transfer method and apparatus

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S827000, C414S680000, C414S749400

Reexamination Certificate

active

07726011

ABSTRACT:
In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation. Vacuum is transferred to the collet from a stationary pressure source by groove sections (106) in a transfer assembly stator (100) communicating through a gap (104) between the rotatable transfer assembly (32) and the transfer assembly stator (100) with gas ducts in the transfer head (14; 40a-40d) and the corresponding collet (66a-66d). A chip (42) is picked up from a wafer (44) by a needle mechanism (224).

REFERENCES:
patent: 4461610 (1984-07-01), Harigane et al.
patent: 4653664 (1987-03-01), Hineno et al.
patent: 4913335 (1990-04-01), Yoshida
patent: 6171049 (2001-01-01), Wirz et al.
patent: 2002/0031423 (2002-03-01), Mannhart et al.
patent: 0 312 116 (1989-04-01), None

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