Chip to chip optic alleys and method

Details Chip to chip optic alleys and method Chip to chip optic alleys and method

2005-05-27

2009-10-13

Leung, Christina Y (Department: 2613)

Optical communications

Transmitter and receiver system

Including optical circuit board

C398S154000

Reexamination Certificate

active

07603040

ABSTRACT:
A data link includes an ASIC. The data link includes a heat insulation layer in contact with the ASIC. The data link includes an optical transducer layer having a plurality of transducers, with each transducer of the plurality of transducers in communication with the ASIC. Each transducer converting optical signals to electrical signals or electrical signals to optical signals. The data link includes an optical waveguide layer having a plurality of waveguides for carrying optical signals. Each waveguide of the plurality of waveguides in optical communication with a transducer, the optical waveguide layer adjacent with the insulation layer. An apparatus for data. A method for transferring data.

REFERENCES:
patent: 5345527 (1994-09-01), Lebby et al.
patent: 5692166 (1997-11-01), Milhizer et al.
patent: 6527456 (2003-03-01), Trezza
patent: 6620642 (2003-09-01), Dudoff et al.

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