Chip socket for basic input/output system

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C439S638000, C439S070000

Reexamination Certificate

active

07604485

ABSTRACT:
A chip socket includes first and second bottom plates attached together, four first sidewalls and second sidewalls, and a number of first and second conductive. Each of the first sidewalls vertically extends upward from a side of the first bottom plate. The first conductive metal sheets are fixed in an inner side of each of the first sidewalls. The conductive metal sheets are insulated from one another. Each of the second sidewalls vertically extends downward from a side of the second bottom plate. The second conductive metal sheets are fixed in an inner side of each of the second sidewalls. The second conductive metal sheets are insulated from one another. Each of the first conductive metal sheets are connected to a corresponding second conductive metal sheet by the first conductive metal sheet extending through the first and second bottom plates to contact with the second conductive metal sheet.

REFERENCES:
patent: 4045105 (1977-08-01), Lee et al.
patent: 7354278 (2008-04-01), Pan
patent: 2008/0115122 (2008-05-01), Wang

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