Chip selection in automatic assembly of integrated circuit

Details Chip selection in automatic assembly of integrated circuit Chip selection in automatic assembly of integrated circuit

1984-03-22

1986-12-09

Siemens, Terrance L.

Material or article handling

Apparatus for moving intersupporting articles into, within,...

Stack forming apparatus

414222, 414752, 221 74, B25J 900

Patent

active

046277870

ABSTRACT:
A method for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and the knocks a die down from the array of dice into a receptacle for transport to further processing stages.

REFERENCES:
patent: 4221533 (1980-09-01), Heim et al.
patent: 4393808 (1983-07-01), Braden
patent: 4410103 (1983-10-01), Fuhrmeister
patent: 4437232 (1984-03-01), Araki et al.
patent: 4494902 (1985-01-01), Kuppens

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