Chip selection in automatic assembly of integrated circuit

Details Chip selection in automatic assembly of integrated circuit Chip selection in automatic assembly of integrated circuit

1986-10-27

1988-07-26

Spar, Robert J.

Material or article handling

Apparatus for charging a load holding or supporting element...

With simultaneous charging and discharging of plural load...

414417, B65G 6500

Patent

active

047596759

ABSTRACT:
An apparatus for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and then knocks a die down from the array of dice into a receptacle for transport to further processing stages.

REFERENCES:
patent: 3785507 (1974-01-01), Wiesler et al.
patent: 4476626 (1984-10-01), Gumbert et al.
patent: 4526646 (1985-07-01), Suzuki et al.

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