Boring or penetrating the earth – With magazine for successively moving unconnected – oriented...
Patent
1999-01-29
2000-08-29
Cuchlinski, Jr., William A.
Boring or penetrating the earth
With magazine for successively moving unconnected, oriented...
361707, 361383, 361600, 205 78, 257675, 257687, 257712, H05K 2328
Patent
active
061093696
ABSTRACT:
A chip scale package includes a mandrel built flexible circuit having a circuit trace on a first surface and an aperture extending therethrough. The chip scale package includes a pad covering the aperture on the first surface of the flexible circuit and a raised interconnection member extending outwardly from the pad. The chip scale package also includes a chip secured to a second surface of the flexible circuit, such that the chip is electrically connected to the pad.
REFERENCES:
patent: 5173766 (1992-12-01), Long et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5777391 (1998-07-01), Nakamura et al.
Cochrane Robert Joseph
Crumly William Robert
Feigenbaum Haim
Hudson Pete Henry
Jensen Eric Dean
Cuchlinski Jr. William A.
Delphi Technologies Inc.
Jones Richard A.
Mancho Ronnie
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