Chip scale marker and marking method

Electric heating – Metal heating – By arc

Reexamination Certificate

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Details

C219S121690

Reexamination Certificate

active

06870127

ABSTRACT:
A chip scale marker includes a laser system performing laser marking, a wafer holder on which a wafer subject to the laser marking is mounted, the wafer holder comprising a vacuum plate disposed at a center of the wafer holder for sucking the wafer and a wafer rotating unit provided at a circumference of the vacuum plate and having an open area facing the laser system, a camera disposed above the wafer holder to photograph the wafer, and a warpage removing unit provided above the wafer holder for removing warpage from the wafer.

REFERENCES:
patent: 4941255 (1990-07-01), Bull
patent: 6599760 (2003-07-01), Watanabe
patent: 20020004358 (2002-01-01), Vepa et al.
patent: 20040031779 (2004-02-01), Cahill et al.
patent: 20040060910 (2004-04-01), Schramm
patent: 20040144760 (2004-07-01), Cahill et al.
patent: 20040152233 (2004-08-01), Nemets et al.
patent: 09-248692 (1997-09-01), None

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