Chip-scale electronic component package

Details Chip-scale electronic component package Chip-scale electronic component package

1998-07-14

2000-09-05

Gaffin, Jeffrey

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361752, 361753, H05K 116

Patent

active

061146358

ABSTRACT:
A chip-scale sized package for acoustic wave devices, acoustic resonators and similar acoustic devices located upon, or fabricated upon, or as part of, a die. The package includes a lid that is bonded to the die by a strip of solder or other bonding material so as to leave a space between the lid and that portion of the die that acoustically deforms or vibrates. The upper surface of the lid includes electrical connectors that are electrically connected via plated through holes or other means to electrical connectors, or pads on the lower surface of the lid, which pads, in turn, are electrically connected by solder or other electrically conducting material to electrical connectors to the device that are located upon the surface of the die.

REFERENCES:
patent: 4905075 (1990-02-01), Temple et al.
patent: 4914741 (1990-04-01), Brown et al.
patent: 4972253 (1990-11-01), Palino et al.
patent: 5023398 (1991-06-01), Mahulikar et al.
patent: 5099392 (1992-03-01), Miller et al.
patent: 5418329 (1995-05-01), Katoh et al.
patent: 5745986 (1998-05-01), Variot et al.
patent: 5808872 (1998-09-01), Ozawa
patent: 5827999 (1998-10-01), McMillan et al.
patent: 5950073 (1999-09-01), Griffin, IV et al.

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