Chip resistor fabrication method

Details Chip resistor fabrication method Chip resistor fabrication method

2008-06-03

2008-06-03

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S417000, C029S830000, C029S832000, C264S272140, C438S015000, C438S118000

Reexamination Certificate

active

07380333

ABSTRACT:
A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to enclose the resistive element. Then, the substrate and the resin layer are cut in this order. To prevent the breakage of the substrate during the cutting, the resin layer has better machinability than the substrate.

REFERENCES:
patent: 6080602 (2000-06-01), Tani et al.
patent: 6153256 (2000-11-01), Kambara et al.
patent: 6304167 (2001-10-01), Nakayama
patent: 6344162 (2002-02-01), Miyajima
patent: 6368893 (2002-04-01), Tani et al.
patent: 6495379 (2002-12-01), Iketani
patent: 02-010879 (1990-01-01), None
patent: 08-102454 (1996-04-01), None
patent: 10-321421 (1998-12-01), None
patent: 11-087102 (1999-03-01), None
patent: 11-224802 (1999-08-01), None
patent: 11-307323 (1999-11-01), None
patent: 2000-068104 (2000-03-01), None
patent: 2002-050591 (2002-02-01), None
Japanese Office Action mailed Oct. 24, 2006.
English language Abstracts of JP 02-010879; 10-321421; 11-087102; 11-224802; 11-307323; 2000-068104.

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