Chip resistor

Coating processes – Electrical product produced – Resistor for current control

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Details

156246, 156247, 156250, 264 61, 428901, 427282, B05D 512

Patent

active

048942588

ABSTRACT:
Thick film resistors are fabricated for use in hybrid microcircuits by a sequence of steps beginning with the formation of a dielectric substrate on a carrier substrate. The dielectric layer is then baked to provide an appropriate rigidity after which a resistance element is deposited thereon as well as conductive terminals, the subsequent firing of both materials followed by heating of the entire assembly to a point where the adhesive characteristics of the dielectric layer are substantially reduced and the resultant film resistors become separated from the carrier substrate.

REFERENCES:
patent: 4349496 (1982-09-01), Levinson
patent: 4366198 (1982-12-01), Ramspacher, Jr.
patent: 4370288 (1983-01-01), Rice, Jr. et al.
patent: 4734233 (1985-03-01), Toda et al.

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