Chip removal apparatus and method of using same

Details Chip removal apparatus and method of using same Chip removal apparatus and method of using same

1991-04-25

1992-12-29

Eley, Timothy V.

Metal working

Means to assemble or disassemble

Means to disassemble electrical device

228191, 228264, B23P 1900

Patent

active

051740168

ABSTRACT:
A chip removal method and apparatus for use with a robotic unit. The chip removal apparatus includes a heated center quill and a soldering unit which cooperate together with a chip removal tool for simultaneously disabling the bonding materials securing a chip to a printed circuit board. The method permits the fine pitch chip device to be removed from the printed circuit board substantially intact for subsequent testing purposes.

REFERENCES:
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patent: 4521959 (1985-06-01), Sprenkle
patent: 4528746 (1985-07-01), Yoshimura
patent: 4586252 (1986-05-01), Faticanti
patent: 4799617 (1989-01-01), Friedman
patent: 4817273 (1989-04-01), Lape et al.
patent: 4828162 (1989-05-01), Donner et al.
patent: 4934582 (1990-06-01), Bertram et al.
patent: 5065933 (1991-11-01), Basavanhally
patent: 5072874 (1991-12-01), Bertram et al.
IBM Technical Disclosure Bulletin, "Chip Removal Method", vol. 31, No. 11, p. 214, Apr. 1989.
Insulation/Circuits, "Desolder and remove Dip's in one motion", vol. 22, No. 9, pp. 39-41, Aug. 1976.

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