Chip receptacle, method for fabricating a chip receptacle...

Details Chip receptacle, method for fabricating a chip receptacle... Chip receptacle, method for fabricating a chip receptacle...

2004-04-29

2008-11-04

Pert, Evan (Department: 2826)

Special receptacle or package

Holder for a removable electrical component

C206S714000, C206S723000, C216S002000, C414S758000, C414S935000

Reexamination Certificate

active

07445119

ABSTRACT:
Cavities for holding semiconductor chips are etched anisotropically into a semiconductor wafer. An orientation of the wafer in the (100) pulling direction results in geometrically exactly etched sidewalls of the cavities with an angle of 125.3°. What is thereby achieved is that chips can slip into the cavity with a low risk of damage. A transparent cover plate is situated on the cavity plate.

REFERENCES:
patent: 3465874 (1969-09-01), Hugle et al.
patent: 5252294 (1993-10-01), Kroy et al.
patent: 5707537 (1998-01-01), Bartha et al.
patent: 6366468 (2002-04-01), Pan
patent: 2005/0194668 (2005-09-01), Enquist et al.

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