Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S778000, C257SE23123, C257SE23169, C257SE23175

Reexamination Certificate

active

07847414

ABSTRACT:
A chip package structure including a first substrate, a second substrate, a plurality of bumps, a first B-staged adhesive layer and a second B-staged adhesive layer is provided. The first substrate has a plurality of first bonding pads. The second substrate has a plurality of second bonding pads, and the second substrate is disposed above the first substrate. The bumps are disposed between the first substrate and the second substrate, wherein each of the first bonding pads is respectively electrically connected to one of the second bonding pads via one of the bumps. The first B-staged adhesive layer is adhered on the first substrate. The second B-staged adhesive layer is adhered between the first B-staged adhesive layer and the second substrate, wherein the first B-staged adhesive layer and the second B-staged adhesive layer encapsulate the bumps.

REFERENCES:
patent: 6022761 (2000-02-01), Grupen-Shemansky et al.
patent: 6168972 (2001-01-01), Wang et al.
patent: 6189208 (2001-02-01), Estes et al.
patent: 6252301 (2001-06-01), Gilleo et al.
patent: 6410415 (2002-06-01), Estes et al.
patent: 6555917 (2003-04-01), Heo
patent: 2001/0051392 (2001-12-01), Akram
patent: 2002/0028535 (2002-03-01), Brand
patent: 2002/0089067 (2002-07-01), Crane et al.
patent: 2003/0057552 (2003-03-01), Kainuma et al.
patent: 2006/0030071 (2006-02-01), Mizukoshi et al.
patent: 2007/0148817 (2007-06-01), Williams et al.
patent: 1956179 (2007-05-01), None
U.S. Office Action of U.S. Appl. No. 12/169,132, dated Jun. 24, 2009.
Chinese First Examination Report of China Application No. 2005101172129, dated Jan. 4, 2008.
Chinese First Examination Report of China Application No. 200810214686.9, dated Apr. 16, 2010.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chip package structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip package structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip package structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4160790

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.