Chip package sealing method

Details Chip package sealing method Chip package sealing method

2011-07-05

2011-07-05

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE21499

Reexamination Certificate

active

07972901

ABSTRACT:
A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.

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