Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate
2006-12-21
2009-12-01
Hoang, Quoc D (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Alignment marks
C438S401000, C257SE23001, C257SE23179, C257SE21525
Reexamination Certificate
active
07626278
ABSTRACT:
A chip package including a substrate, a chip and a mark is provided. The substrate has a carrying surface. A mark region is disposed on the carrying surface. The chip is disposed on the carrying surface and electrically connected to the substrate. The mark is disposed in the mark region for recording a process parameter.
REFERENCES:
patent: 5256578 (1993-10-01), Corley et al.
patent: 6468813 (2002-10-01), Chao et al.
patent: 2006/0128040 (2006-06-01), Chen et al.
Chou Chien-Chen
Hung Chi-Feng
Lu Hung-Hsiang
Advanced Semiconductor Engineering Inc.
Hoang Quoc D
Rabin & Berdo P.C.
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