Chip package

Details Chip package Chip package

2006-08-15

2006-08-15

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S777000, C257S778000, C257S780000

Reexamination Certificate

active

07091608

ABSTRACT:
The chip package comprising a package substrate, a circuit layer, a chip and at least one conductive wire is provided. The circuit layer is disposed on a first surface of the substrate, and extends from the first surface to a second surface of the substrate via the inner surface of a slot of the substrate. The chip is disposed on the second surface of the substrate to cover the slot and a portion of the circuit layer. The chip has at least one signal pad and at least one non-signal pad. The non-signal pad is electrically connected to the circuit layer on the second surface. The slot in the substrate exposes the signal pad. One end of the conductive wire passing through the slot is connected to the signal pad while the other end thereof is connected to the circuit layer on the first surface of the substrate.

REFERENCES:
patent: 6093969 (2000-07-01), Lin
patent: 6218731 (2001-04-01), Huang et al.
patent: 6521980 (2003-02-01), Tandy et al.
patent: 6822337 (2004-11-01), Bai
patent: 6969914 (2005-11-01), Fuller et al.

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