Chip on chip type integrated circuit device

Details Chip on chip type integrated circuit device Chip on chip type integrated circuit device

1985-07-26

1987-10-27

Smith, Jerry

Excavating

371 15, 324 73R, G01R 3128

Patent

active

047034831

ABSTRACT:
A circuit for checking the integrity of interconnections between chips in a chip-on-chip type IC device is fabricated in respective portions on the lower and upper chips in peripheral areas thereof intermediate the inner logic circuit of each chip and the corresponding bonding pads. Selection circuits connected between the inner logic circuit signal terminals and the corresponding bonding pads of the chip are switched by control signals to be isolated and permit normal operation of the chip or to a checking mode to isolate the inner logic circuit and permit transmission of test signals through the interconnections. The test signals received through the interconnections are compared with the test signals as transmitted to determine the integrity of the individual interconnections. The disclosed apparatus and method provide for testing of the integrity of interconnections defining single direction signal paths of individual interconnections, as between the upper and lower chips, and for selectively bidirectional transmission through the individual interconnections.

REFERENCES:
patent: 4241307 (1980-12-01), Hong
patent: 4244048 (1981-01-01), Tsui
patent: 4497056 (1985-01-01), Sugamori
patent: 4503386 (1985-03-01), Dasgupta
patent: 4504784 (1985-03-01), Goel
patent: 4509008 (1985-04-01), Dasgupta

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