Chip-on-board printed circuit assembly using aluminum wire bonde

Details Chip-on-board printed circuit assembly using aluminum wire bonde Chip-on-board printed circuit assembly using aluminum wire bonde

1996-03-08

1998-06-23

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361772, 361771, 361777, 361779, 361783, 174251, 174259, 174260, 174 522, 174 523, 257723, 257724, 257786, 257784, 257787, 257788, 257793, 2281231, H05K 118

Patent

active

057711577

ABSTRACT:
A printed circuit board carries a microcircuit package electrically connected to bare copper connector pads on the printed circuit board microcircuit package by aluminum wires. The copper connection pads are encapsulated by a material such as low stress liquid encapsulant having a thermal expansion coefficient approximately equal to that of the printed circuit board substrate material. Preferably the printed circuit board laminate comprises cellulose epoxy mat such as CEM-1.

REFERENCES:
patent: 4501787 (1985-02-01), Marchetti et al.
patent: 5313365 (1994-05-01), Pennisi et al.
patent: 5410181 (1995-04-01), Zollo et al.

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