Chip on board package for integrated circuit devices using print

Details Chip on board package for integrated circuit devices using print Chip on board package for integrated circuit devices using print

1986-05-23

1988-03-01

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 16HS, 357 81, 361401, 361414, H05K 720

Patent

active

047290617

ABSTRACT:
The invention discloses an improved PC board package for at least one integrated circuit die utilizing a plurality of PC boards bonded together to form a composite. The composite has at least one cavity, for mounting of an integrated circuit die, formed in at least one PC board of the composite. The cavity walls are plated to seal off portions of the PC board exposed by formation of the cavity to thereby prevent subsequent outgassing. Heat tubes are formed in a PC board adjacent the PC board with the cavity to conduct heat from an integrated circuit chip mounted in the cavity to an opposite surface of the package.

REFERENCES:
patent: 3400210 (1968-09-01), Reimer
patent: 3867759 (1975-02-01), Siefker
patent: 3932932 (1976-01-01), Goodman
patent: 4143508 (1979-03-01), Ohno
patent: 4150421 (1979-04-01), Nishihara et al.
patent: 4327399 (1982-04-01), Sasaki et al.
Dutcher et al., "Heat Pipes-A Cool Way to Cool Circuitry, " Electronics, 2/16/70, pp. 94-100.

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