Chip on a board

Details Chip on a board Chip on a board

2005-12-21

2008-09-16

Zarroli, Michael C. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C029S842000, C361S807000

Reexamination Certificate

active

07426117

ABSTRACT:
An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC die/substrate gap definition between the IC die and the substrate.

REFERENCES:
patent: 5944537 (1999-08-01), Smith et al.
patent: 6008991 (1999-12-01), Hawthorne et al.
patent: 6110823 (2000-08-01), Eldridge et al.
patent: 6232149 (2001-05-01), Dozier et al.
patent: 6330164 (2001-12-01), Khandros et al.
patent: 6339534 (2002-01-01), Coico et al.
patent: 6646533 (2003-11-01), Biegelson et al.
patent: 6815961 (2004-11-01), Mok et al.
patent: 2006/0274512 (2006-12-01), Brandenburg et al.
“Nano-spring arrays for high density interconnect”, David K. Fork, et al., Proceedings of the 2000 SPIE—The International Society for Optical Engineering, Micro-machined Devices and Components VI (vol. 4176) (pp. 226-235).
“UV-Tapes for Semiconductor Processing”, Furukawa Electric, http://www.furukawa.co.jp/tukuru/pdf/uvtape e.pdf (4 pages), no date supplied.
“Room Temperature Vacuum Sealing Using Surface Activated Bonding Method”, Toshihiro Itoh, Hironao Okada, Hideki Takagi, Ryutaro Maeda and Tadatomo Suga, Transducers '03, The 12thInternational Conference on Solid State Sensors, Actuators and Microsystems, Boston, Jun. 8-12, 2003, (pp. 1828-1831).

Affiliated with

Also associated with

Rating

Chip on a board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip on a board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip on a board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3971410