Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-09-16
2008-09-16
Zarroli, Michael C. (Department: 2839)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C029S842000, C361S807000
Reexamination Certificate
active
11314827
ABSTRACT:
An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC die/substrate gap definition between the IC die and the substrate.
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Fork David K.
Hantschel Thomas
Peeters Eric
Van Schuylenbergh Koenraad F.
Fay Sharpe LLP
Xerox Corporation
Zarroli Michael C.
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