Electrical resistors – With mounting or supporting means – Plural resistors
Patent
1998-08-27
1999-12-21
Gellner, Michael L.
Electrical resistors
With mounting or supporting means
Plural resistors
338308, 338309, 338332, 29620, 29621, H01C 1012
Patent
active
060054743
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
This invention relates to a chip-like network resistor having a plurality of resistance elements formed on a substrate and a method for manufacturing the same.
BACKGROUND ART
The inventors disclosed a general structure of a chip-like network resistor in Japanese Patent Application Laid-Open Publication No. 78701/1995. The chip-like network resistor disclosed in the publication includes an insulating substrate which is formed on each of both ends thereof with a plurality of recesses, a plurality of thick-film electrodes arranged adjacently to the recesses, and resistance elements each arranged between each pair of thick-film electrodes. Also, the resistor includes terminal electrodes each are arranged so as to cover an inner surface of the recess and connected to the thick-film electrode corresponding thereto. The terminal electrodes each include a thin metal film electrode layer and a plated electrode layer of a two-layer structure arranged so as to cover the thin metal film electrode layer. The thin metal film electrode layer includes a front surface electrode section formed on a front surface of the insulating substrate so as to overlap with the thick-film electrode, a side surface electrode section connected to the front surface electrode section and arranged so as to cover a whole inner surface of the recess and a rear surface electrode section connected to the side surface electrode section and arranged on a rear surface of the insulating substrate.
Conventionally, manufacturing of such a resistor is carried out by first providing a large-sized insulating substrate which is formed on a front surface thereof with lattice-like separation grooves constituted of a plurality of longitudinal grooves and a plurality of lateral grooves. Also, the insulating substrate is formed with a plurality of through-holes of a circular shape in cross section, each of which is arranged along a portion of the lateral groove positioned between each adjacent two of the longitudinal grooves. Thereafter, the large-sized insulating substrate is formed on the front surface thereof with a plurality of thick-film electrodes (primary electrodes), which are positioned on regions each interposed between each adjacent two of the lateral grooves and between each adjacent two of the longitudinal grooves while being in proximity to each of the through-holes. Then, the regions each are formed thereon with a plurality of resistance elements in a manner to extend between two of the thick-film electrodes opposite to each other, followed by covering of the resistance elements with a glass coating. Then, a resistance of the resistance element is measured by means of a probe electrode for measurement which is kept contacted at a distal end or tip thereof with the thick-film electrodes positioned on both sides of the resistance element. Then, laser trimming is carried out depending on the resistance measured, to thereby adjust the resistance to a desired value. After the trimming, the glass coating is covered with glass or resin. Then, the through-holes each are covered at both ends and an inner surface thereof with a thin metal film and then the large-sized insulating substrate is separated into a plurality of chip-like elements along the longitudinal and lateral grooves. Lastly, the chip-like elements each are subject on an electrode section thereof to plating.
The separation of the substrate into the chip-like elements causes the through-holes to be cut, leading to formation of the recesses and thin metal film electrode layer described above. The front surface electrode section of the thin metal film electrode layer is merely required to permit the thick-film electrode and side surface electrode section to be connected to each other, thus, the prior art does not pay any specific attention to a configuration of the front surface electrode section. Therefore, the conventional resistor is not constructed in such a manner that the front surface electrode section is arranged so as to fully surround a circumference or periphery
REFERENCES:
patent: 4899126 (1990-02-01), Yamada
Shimada Mahito
Takeuchi Katsumi
Gellner Michael L.
Hokuriku Electric Industry Co., Ltd.
Lee Richard K.
Rankin Carl A.
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