Chip mounting techniques for display apparatus

Details Chip mounting techniques for display apparatus Chip mounting techniques for display apparatus

1992-10-26

1994-01-18

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562757, 1563809, B32B 3100

Patent

active

052796949

ABSTRACT:
Driver circuit chip mounting techniques for use in the fabrication of monolithic flat panel displays are disclosed in accordance with the teachings of the present invention. According to a preferred embodiment, a driver circuit having a spot of optical cement is precisely positioned within a location of metalized, grouped and patterned row or column conductors. Thereafter collimated ultraviolet light is imaged through the display onto the rear of the driver circuit until the optical cement has become sufficiently tacky to permit the display to be inverted whereupon collimated ultraviolet light may be directly applied to complete the full curing of the optical cements.

REFERENCES:
patent: 3960624 (1976-06-01), Erlandson
patent: 3989778 (1976-11-01), Osborne
patent: 4500382 (1985-02-01), Foster
patent: 4622580 (1986-11-01), Levine
patent: 4661191 (1987-04-01), Kamio et al.
patent: 4892607 (1990-01-01), DiSanto et al.
patent: 4970369 (1990-11-01), Yamazaki et al.

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