Chip mounting techniques for display apparatus

Details Chip mounting techniques for display apparatus Chip mounting techniques for display apparatus

1988-06-14

1990-01-09

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156297, 357 73, 357 74, 445 24, B32B 3128

Patent

active

048926078

ABSTRACT:
Driver circuit chip mounting techniques for use in the fabrication of monolithic flat panel displays are disclosed in accordance with the teachings of the present invention. According to a preferred embodiment, a driver circuit having a spot of optical cement is precisely positioned within a location of metalized, grouped and patterned row or column conductors. Thereafter collimated ultraviolet light is imaged through the display onto the rear of the driver circuit until the optical cement has become sufficiently tacky to permit the display to be inverted whereupon collimated ultraviolet light may be directly applied to complete the full curing of the optical cements.

REFERENCES:
patent: 1946878 (1934-02-01), Pazziani
patent: 3989778 (1976-11-01), Osborne
patent: 4222635 (1980-09-01), Jolke
patent: 4418284 (1983-11-01), Ogawa
patent: 4661191 (1987-04-01), Kamio

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