Chip mounting substrate having an integral molded projection and

Details Chip mounting substrate having an integral molded projection and Chip mounting substrate having an integral molded projection and

1990-05-16

1992-01-14

Hille, Rolf

357 68, H01L 2312, H01L 2314

Patent

active

050815202

ABSTRACT:
The present invention provides an improved chip mounting method for mounting an IC chip on a substrate, comprising the steps of; integrally molding a projection on the substrate, the projection being located on a surface of the substrate on which the IC chip will be mounted; forming a conductive pattern on the projection and on a necessary portion of the substrate; forming a connecting layer on the conductive pattern formed on the projection; and fixing said IC chip on the substrate while electrically connecting an exposed electrode of the IC chip with the conductive pattern formed on the projection through the connecting layer.

REFERENCES:
patent: 4143385 (1979-03-01), Miyoshi et al.
patent: 4483067 (1984-11-01), Parmentier
patent: 4494688 (1985-01-01), Hatada et al.
patent: 4928387 (1990-05-01), Mather et al.
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 4955132 (1990-09-01), Ozawa
Hamatight M Series (The Yokihama Rubber Co., Ltd.).
MOFIT HM-1000 (Osaka Soda Co., Ltd.).
Hitachi Chemical Semiconductor Device (Hitachi Chemical Co., Ltd.).

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