Chip mounting device

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S564000, C029S720000, C029S721000, C029S739000

Reexamination Certificate

active

06993832

ABSTRACT:
A chip mounting device of the present invention includes: an adhesive application unit11; a temporary crimp unit12; and a main crimp unit13. In the unit11, a camera21is used for detecting base material marks for each section region on a film base material1and substrate marks for each substrate pattern in the section region. The detected results are transferred to the unit12. In the unit12, a camera45is used for detecting base material marks, and the position of each substrate pattern is recognized on the basis of on the detection results and the positional data of each substrate pattern transmitted from the unit11, thereby crimping chips temporarily. This enables the chips to be mounted with high precision even when the film base material1is expanded and contracted. In the unit12, there is no detection of substrate marks, which minimizes a decrease in processing efficiency.

REFERENCES:
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patent: 5681757 (1997-10-01), Hayes
patent: 5854745 (1998-12-01), Muraoka et al.
patent: 5938874 (1999-08-01), Palomo et al.
patent: 6193136 (2001-02-01), Higashi et al.
patent: 6286202 (2001-09-01), Asai et al.
patent: 6317972 (2001-11-01), Asai et al.
patent: 6643921 (2003-11-01), Asai et al.
patent: 6807725 (2004-10-01), Asai et al.
patent: 08-114844 (1996-05-01), None
patent: 2001-320196 (2001-11-01), None
International Preliminary Examination Report for PCT/JP02/01890 completed on May 6, 2003.

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