Metal fusion bonding – Process – Plural joints
Patent
1983-06-30
1987-05-12
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
228 563, 228175, 228249, 228248, 339 17M, H01L 2158, B23K 112
Patent
active
046643095
ABSTRACT:
A chip mounting device which is hereinafter also referred to as an "interconnection preform placement device", includes a retaining member having a predefined pattern of holes in which are positioned preforms of joint-forming material such as solder. Each preform is of a predefined configuration and has a height or length greater than is cross-sectional dimension. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. A method of forming resilient interconnections comprises placing the interconnection preform placement device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms.
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Allen Leslie J.
Cherian Gabe
Diaz Stephen H.
Burkard Herbert G.
Dillahunty T. Gene
Ramsey Kenneth J.
Raychem Corporation
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