Chip mounting apparatus

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29743, 29759, H05K 330

Patent

active

049148095

ABSTRACT:
An apparatus featuring a suction head assembly for transferring a set of chips from a template assembly to a printed circuit board. In order to make the suction head assembly readily adaptable for mounting the chips in any of numerous different arrangements on circuit boards, a planar head carrier is provided which has a multiplicity of mounting holes formed therein in columns and rows. A set of suction heads can be mounted to the head carrier in any desired arrangement, corresponding to the desired chip arrangement on the circuit board, by having their holders removably engaged in selected ones of the array of mounting holes in the head carrier. The template assembly is likewise made adaptable for a variety of chip arrangements, by having a set of open-top positioning vessels removably engaged in selected ones of an array of mounting holes formed in a template.

REFERENCES:
patent: 3963456 (1976-06-01), Tsuchiya et al.
patent: 4375126 (1983-03-01), Dull et al.
patent: 4451324 (1984-05-01), Ichikawa et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chip mounting apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip mounting apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip mounting apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2290703

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.