Chip mounting apparatus

Details Chip mounting apparatus Chip mounting apparatus

1990-09-14

1992-02-04

Arbes, Carl J.

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29720, 29833, 29846, B23P 1900

Patent

active

050849590

ABSTRACT:
A chip mounting apparatus includes an X-Y robot having a chip mounting head and a substrate position recognizing camera both positioned in an upper arm of the robot apparatus. The chip mounting head is for holding a chip to be mounted. A substrate holding member is for holding a chip mounting substrate and is disposed below the robot. A chip position recognizing camera is also disposed below the robot. The positional relationship between the chip mounting head and the substrate position recognizing camera is equivalent to the positional relationship between a chip mounting position of the chip mounting substrate and the chip position recognizing camera.

REFERENCES:
patent: 4738025 (1988-04-01), Arnold
patent: 4912843 (1990-04-01), Dederer
patent: 4922434 (1990-05-01), Fule
patent: 4980971 (1991-01-01), Bartschat et al.
IBM Tech. Disclosure Bulletin, vol. 30, No. 3, Aug. 1987, pp. 980-981.
IBM Tech. Discl. Bull., vol. 30, No. 1, Jun. 1987, pp. 228-234 entitled "Surface-Mounted Device Placement".

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