Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-03-04
2008-03-04
Dinh, Tuan T. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S775000, C361S776000, C361S813000
Reexamination Certificate
active
10140358
ABSTRACT:
The present invention describes a pre-fabricated chip mount and a method for making the pre-fabricated mount. The mount includes a mount body and a protective ring attached to the body by a plurality of tabs. The mount also includes a plurality of inner leads in electrical communication with the wires of at least one leadframe and a receiving area for an integrated circuit chip. The present invention also describes chips mounted on the pre-fabricated mount and methods for mounting, wire-bonding and encapsulating the chip in the mount. The mounts of the present invention can also be adapted to accommodate multiple chips and multi-level bonding schemes to the chips.
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Dinh Tuan T.
Strozier Robert W
LandOfFree
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