Chip module for complete power train

Details Chip module for complete power train Chip module for complete power train

2011-01-25

2011-01-25

Vu, Hung (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S329000

Reexamination Certificate

active

07875498

ABSTRACT:
A chip module is disclosed. It includes a circuit substrate, a semiconductor die comprising a power transistor mounted on the circuit substrate, and a passive electronic component. The passive electronic component is in electrical communication with the semiconductor die, and is in thermal communication with the semiconductor die.

REFERENCES:
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4720396 (1988-01-01), Wood
patent: 4731701 (1988-03-01), Kuo et al.
patent: 4751199 (1988-06-01), Phy
patent: 4772935 (1988-09-01), Lawler et al.
patent: 4791473 (1988-12-01), Phy
patent: 4796080 (1989-01-01), Phy
patent: 4839717 (1989-06-01), Phy et al.
patent: 4890153 (1989-12-01), Wu
patent: 5327325 (1994-07-01), Nicewarner, Jr.
patent: 5646446 (1997-07-01), Nicewarner, Jr. et al.
patent: 5776797 (1998-07-01), Nicewarner, Jr. et al.
patent: 6133634 (2000-10-01), Joshi
patent: 6278264 (2001-08-01), Burstein et al.
patent: 6329706 (2001-12-01), Nam
patent: 6424035 (2002-07-01), Sapp et al.
patent: 6432750 (2002-08-01), Jeon et al.
patent: 6449174 (2002-09-01), Elbanhawy
patent: 6489678 (2002-12-01), Joshi
patent: 6507115 (2003-01-01), Hofstee et al.
patent: 6556750 (2003-04-01), Constantino et al.
patent: 6566749 (2003-05-01), Joshi et al.
patent: 6574107 (2003-06-01), Jeon et al.
patent: 6611434 (2003-08-01), Lo et al.
patent: 6621152 (2003-09-01), Choi et al.
patent: 6627991 (2003-09-01), Joshi
patent: 6642738 (2003-11-01), Elbanhawy
patent: 6645791 (2003-11-01), Noquil et al.
patent: 6674157 (2004-01-01), Lang
patent: 6683375 (2004-01-01), Joshi et al.
patent: 6696321 (2004-02-01), Joshi
patent: 6720642 (2004-04-01), Joshi et al.
patent: 6731003 (2004-05-01), Joshi et al.
patent: 6740541 (2004-05-01), Rajeev
patent: 6756689 (2004-06-01), Nam et al.
patent: 6774465 (2004-08-01), Lee et al.
patent: 6777800 (2004-08-01), Madrid et al.
patent: 6806580 (2004-10-01), Joshi et al.
patent: 6830959 (2004-12-01), Estacio
patent: 6836023 (2004-12-01), Joshi et al.
patent: 6867481 (2005-03-01), Joshi et al.
patent: 6867489 (2005-03-01), Estacio
patent: 6891256 (2005-05-01), Joshi et al.
patent: 6891257 (2005-05-01), Chong et al.
patent: 6893901 (2005-05-01), Madrid
patent: 6943434 (2005-09-01), Tangpuz et al.
patent: 6949822 (2005-09-01), Shivkumar et al.
patent: 6989588 (2006-01-01), Quinones et al.
patent: 6992384 (2006-01-01), Joshi
patent: 7022548 (2006-04-01), Joshi et al.
patent: 7023077 (2006-04-01), Madrid
patent: 7061077 (2006-06-01), Joshi
patent: 7061080 (2006-06-01), Jeun et al.
patent: 7081666 (2006-07-01), Joshi et al.
patent: 7217597 (2007-05-01), Akram
patent: 7233065 (2007-06-01), Watanabe et al.
patent: 7656024 (2010-02-01), Elbanhawy et al.
patent: 2004/0238857 (2004-12-01), Beroz et al.
patent: 2004/0238934 (2004-12-01), Warner et al.
patent: 2005/0280163 (2005-12-01), Schaffer et al.
patent: 2006/0012022 (2006-01-01), Ararao et al.
patent: 2006/0055027 (2006-03-01), Kitabatake et al.
patent: 2007/0001278 (2007-01-01), Jeon et al.
patent: 2007/0164428 (2007-07-01), Elbanhawy et al.
Search/Examination Report dated Feb. 25, 2010 from Chinese Patent Application No. 200780024721.4, 7 pages.

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