Chip module

Details Chip module Chip module

2005-11-22

2005-11-22

Frech, Karl D. (Department: 2876)

Registers

Records

C235S490000, C235S492000, C235S491000

Reexamination Certificate

active

06966496

ABSTRACT:
The chip module comprises a semiconductor chip, which is fixed on a main side of a substrate of planar extent. A component, which is provided for taking up, emitting, reflecting or partially shielding electromagnetic radiation, e.g., a radiation sensor or an optical display device (display), is provided on the same main side of the substrate and is connected to the semiconductor chip. The substrate is transmissive to the relevant radiation to a sufficient extent and at least in a region occupied by the component.

REFERENCES:
patent: 5541399 (1996-07-01), de Vall
patent: 6412701 (2002-07-01), Kohama et al.
patent: 6581839 (2003-06-01), Lasch et al.
patent: 43 19 878 (1993-12-01), None
patent: 43 14 879 (1994-11-01), None
patent: 0 913 268 (1999-05-01), None
patent: 2 786 902 (2000-06-01), None

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