Chip microphone and method of making same

Details Chip microphone and method of making same Chip microphone and method of making same

2007-11-20

2007-11-20

Woo, Stella (Department: 2614)

Electrical audio signal processing systems and devices

Circuitry combined with specific type microphone or loudspeaker

C381S175000

Reexamination Certificate

active

10235044

ABSTRACT:
A chip microphone implemented as a single silicon-based chip includes a diaphragm which includes a vibration portion that vibrates in response to sound pressures, a support block which is formed on the diaphragm, excluding at least the vibration portion to provide a vibration space, and a back plate which is formed on the support block and over the vibration space, thereby facing the vibration portion of the diaphragm across the vibration space.

REFERENCES:
patent: 4558184 (1985-12-01), Busch-Vishniac et al.
patent: 6088463 (2000-07-01), Rombach et al.
patent: 6732588 (2004-05-01), Mullenborn et al.
patent: 2005/0013455 (2005-01-01), Loeb et al.
patent: 6217396 (1994-08-01), None
J. Bergqvist, F. Rudolph, “A silicon condenser microphone using bond and etch-back technology,” Sensors and Actuators A, 45 (1994), pp. 115-124.
Altti Torkkeli, Outi Rusanen, Jaakko Saarilahti, Heikki Seppa, Hannu Sipola, Jarmo Hietanen, “Capacitive microphone with low-stress, polysilicon membrane and high-stress polysilicon backplate”, Sensors and Actuators, 85 (2000), pp. 116-123.

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