Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2005-08-30
2005-08-30
Sarkar, Asok Kumar (Department: 2891)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C438S064000, C438S460000
Reexamination Certificate
active
06936525
ABSTRACT:
A method of manufacturing the semiconductor chips comprises the steps of: pasting on a substrate an adhesive sheet having a property to retain its adhesive strength prior to a processing, then lose its adhesive strength after the processing; fixing a plurality of non-defective bare chips on this adhesive sheet, with their Al electrode pad surfaces facing down; coating a resin on a whole area other than the Al electrode pad surfaces of the plurality of non-defective bare chips including interspaces therebetween; applying a predetermined process to the adhesive sheet to weaken its adhesive strength of the adhesive sheet; peeling off a pseudo wafer bonding non-defective bare chips; and dicing the plurality of non-defective bare chips into a discrete non-defective electronic part by cutting the pseudo wafer at a position of the resin between respective non-defective bare chips.
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Hirayama Teruo
Nishiyama Kazuo
Ozaki Hiroshi
Takaoka Yuji
Depke Robert J.
Sarkar Asok Kumar
Sony Corporation
Trexler, Bushnell, Giangiorgi, Blackstone & Marr
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