Chip level biostable interconnect for implantable medical...

Details Chip level biostable interconnect for implantable medical... Chip level biostable interconnect for implantable medical...

2007-06-05

2007-06-05

Pezzuto, Robert E. (Department: 3766)

Surgery: light, thermal, and electrical application

Light, thermal, and electrical application

Electrical therapeutic systems

C607S036000, C607S009000, C128S899000, C128S898000, C439S909000

Reexamination Certificate

active

11114451

ABSTRACT:
A lead is connected to an integrated circuit in an implantable medical device in a lead bonding region that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrated circuit that is strong and potentially biostable. In some embodiments, a filler material is provided around the recessed portion of the integrated circuit that receives the lead conductor, and a metal coating is provided around an outer surface of the filler material for additional mechanical stability.

REFERENCES:
patent: 6857915 (2005-02-01), Ciurzynski et al.

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