Chip interconnection having a breathable etch stop layer

Details Chip interconnection having a breathable etch stop layer Chip interconnection having a breathable etch stop layer

1992-10-30

1994-12-06

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437195, 148DIG43, 156644, H01L 2190

Patent

active

053710479

ABSTRACT:
An integrated circuit having organic dielectric between interconnection layers eliminates damage caused by vapors outgassing from the organic dielectric by the use of a two-component organic layer having a breathable etch resistant organic layer above the main organic dielectric layer, both of the organic layers remaining in the final circuit. The etch resistant layer is resistant to the etchant used to pattern the layer of interconnect above the organic dielectric.

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