Inductor devices – Windings – Having conductor of particular shape
Patent
1998-11-25
2000-07-04
Gellner, Michael L.
Inductor devices
Windings
Having conductor of particular shape
29606, 336200, 336232, H01F 500, H01F 2728
Patent
active
060845007
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a chip inductor used in electronic appliances, communication appliances, and others, and its manufacturing method.
BACKGROUND ART
In FIG. 6 to FIG. 9, a conventional chip inductor comprises a square columnar main body 21 made of an insulating material, a coil unit 25 having a linear conductor 23 and a groove 24 formed by spirally grooving a conductor layer 22 on the surface of the main body 21, an exterior unit 29 made of an insulating resin 28 applied on the surface of the coil unit 25, and an electrode unit 26 provided at the end portion of the main body 21.
Its manufacturing method comprises a first step of forming a conductor layer 22 on a square columnar main body 21 made of an insulating material, a second step of forming a coil unit 25 having a linear conductor 23 and a groove 24 by grooving the conductor layer 22 by laser 27, a third step of forming electrode units 26 at both ends of the coil unit 25, and a fourth step of forming an exterior unit 29 by coating the coil unit 25 with an insulating resin 28 and drying.
Herein, at the fourth step, while rotating the main body 21 forming the coil unit 25 in the direction of arrow A in FIG. 9(c), on the tape to which the insulating resin 28 is adhered, the insulating resin 28 is applied on the coil unit 25, and the entire circumference of the coil unit 25 is coated with the insulating resin 28.
By drying this insulating resin 28, the exterior unit 29 is formed.
In such conventional constitution, the insulating resin 28 is applied on the surface of the coil unit 25, but the insulating resin 28 was not applied in the inner part of the groove 24 of the coil unit 25.
Generally, in a very small part such as chip inductor (overall dimension being about 1 mm), the interval of adjacent linear conductors 23 in the coil unit 25 is as narrow as scores of microns, and it is hard to coat the insulating resin 28 due to effects of surface tension and others of the insulating resin 28, and coated portions and uncoated portions of the insulating resin 28 coexisted inside the groove 24.
As a result, gaps 40 were formed inside the groove 24 as shown in FIG. 7, and due to air or moisture in the gaps 40, appropriate insulation is not provided between the adjacent linear conductors 23 of the coil unit 25, and short-circuit is caused.
Also in the conventional method, since the insulating region 28 is applied on the coil unit 25 while rotating the main body 21 forming the coil unit 25 on the tape to which the insulating resin 28 is adhered, as shown in FIG. 8, the insulating resin 28 applied on the coil unit 25 forms a circular profile, while surrounding the square columnar main body 21 due to the surface tension.
As a result, the mounting surface by the exterior unit 29 is round, and when mounting a packed substrate or the like, accurate mounting is difficult, and gaps 40 are likely to be formed in the groove 24.
DISCLOSURE OF THE INVENTION
It is hence an object of the invention to present a chip inductor capable of preventing short-circuit and enhancing the electric characteristics by applying an appropriate insulation between adjacent linear conductors of the coil unit, and mounting appropriately by forming a flat mounting surface in the exterior unit, and its manufacturing method.
To achieve the object, the invention is characterized by a constitution comprising a square columnar main body made of an insulating material, electrode units disposed at both sides of the main body, a coil unit connected to the electrode units, and disposed on the outer circumference of the main body between the electrode units, and an exterior unit having the coil unit coated with an insulating resin, in which the coil unit has linear conductors and grooves formed by grooving the conductor layer applied on the surface of the main body, and the insulating resin is also provided in the entire inside of the grooves.
Its manufacturing method comprises a first step of forming a conductor layer on a square columnar main body made of an insulating
REFERENCES:
patent: 5441783 (1995-08-01), Silgailis et al.
patent: 5764126 (1997-04-01), Kanetaka et al.
Fujimori Akira
Kanetaka Toyonori
Nakayama Hideaki
Taoka Mikio
Yoshizawa Toshihiro
Gellner Michael L.
Mai Anh
Matsushita Electric - Industrial Co., Ltd.
LandOfFree
Chip inductor and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chip inductor and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip inductor and method for manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1490281