Chip ID applying method suitable for use in semiconductor...

Details Chip ID applying method suitable for use in semiconductor... Chip ID applying method suitable for use in semiconductor...

2011-05-24

2011-05-24

Menz, Laura M (Department: 2813)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

C430S394000, C257SE23179

Reexamination Certificate

active

07947563

ABSTRACT:
A chip forming position specifying method for applying chip IDs indicative of positions on a wafer where semiconductor chips are formed, and thereby specifying their positions. In the chip forming position specifying method, different marks are formed for every chip in a transfer mask (hereinafter called “mark forming mask”) used to form a wiring layer, in addition to normal functional wirings. The positions of the chips on the wafer are respectively specified according to combinations of the marks of a plurality of the mark forming masks, which have been transferred onto the wafer.

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patent: 6620557 (2003-09-01), Hosono et al.
patent: 6849957 (2005-02-01), Takeuchi et al.
patent: 6924090 (2005-08-01), Hirooka
patent: 7348682 (2008-03-01), Brambilla et al.
patent: 05-175093 (1993-07-01), None

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