Chip fuse and process for production thereof

Details Chip fuse and process for production thereof Chip fuse and process for production thereof

1997-12-16

1999-06-22

Picard, Leo P.

Electricity: electrothermally or thermally actuated switches

Electrothermally actuated switches

Fusible element actuated

337297, 337296, 337295, H01H 8506, H01H 85046, H01H 8508

Patent

active

059146494

ABSTRACT:
A chip fuse comprising an organic resin-made insulating substrate, a pair of electrodes formed at terminals of said organic resin-made insulating substrate, current protecting element wiring portions and a current protecting element positioned between said pair of electrodes and housed in said organic resin-made insulating substrate, said current protecting element having a thickness of 3-8 .mu.m and being supported on an organic resin layer having a high tracking resistance, and at least one space being formed at least on the current protecting element side, does not cause ignition nor smoking and is excellent in clearing characteristics.

REFERENCES:
patent: 4988969 (1991-01-01), Gurevich
patent: 5248852 (1993-09-01), Kumagai
patent: 5446436 (1995-08-01), Williams
patent: 5586014 (1996-12-01), Hasegawa

Affiliated with

Also associated with

Rating

Chip fuse and process for production thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip fuse and process for production thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip fuse and process for production thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1710429