Chip function separation onto separate stacked chips

Details Chip function separation onto separate stacked chips Chip function separation onto separate stacked chips

1995-11-21

1998-10-06

Nelms, David C.

Static information storage and retrieval

Format or disposition of elements

365 63, 365 72, 257686, 257777, G11C 502

Patent

active

058187480

ABSTRACT:
The high-voltage drivers and decoders of a direct-write EEPROM memory array are separated from the word lines and placed onto separate stacked chips. The separate chips are stacked face-to-face, and force-responsive self-interlocking microconnectors are used to physically and electrically connect the separate chips.

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