Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate
2004-10-20
2009-08-04
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
C700S121000
Reexamination Certificate
active
07569402
ABSTRACT:
A chip data providing system is provided. The chip data providing system is equipped with an inspection device for inspecting each chip after processing steps of forming integrated circuits on a plurality chips included in a semiconductor wafer are completed, an inspection server that generates, based on an inspection result, first chip data including information concerning the inspection result of each of the chips, and a chip data providing server that generates, based on the first chip data generated by the inspection server and information concerning an assembly enterprise stored in advance, second chip data in a format suitable for a system of the assembly enterprise that selects and uses the plurality of chips included in the semiconductor wafer, and provides the second chip data to the assembly enterprise.
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Kawahara Kunihiro
Saito Kazuya
Coleman W. David
Harness & Dickey & Pierce P.L.C.
Seiko Epson Corporation
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