Chip connection structure having diret through-hole connections

Details Chip connection structure having diret through-hole connections Chip connection structure having diret through-hole connections

1995-12-14

1999-02-09

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 174261, 174262, 174264, 361760, 361767, 361771, 361783, H05K 114, H05K 116, H05K 702, H05K 706

Patent

active

058702890

ABSTRACT:
A structure for connecting an integrated circuit chip to a wiring substrate which implements high-density packaging, high-density connection, high-speed signal transmission, and low cost. An integrated circuit is connected to a wiring substrate by means of flip-chip die bonding using an adhesive film. A direct through-hole connection is formed directly below a connecting pad so as to pass through the adhesive film and the wiring substrate. This direct through-hole connection directly connects the connecting pad to the wire. As a result of reduced area and thickness of the chip, the chip is mounted in high density, and high-density inputs and outputs are implemented by means of minute two-dimensional connections. Short wire connections directly connected to the chip permit high speed signal transmission, and high reliability is ensured by the dispersion of stress. Low-cost packaging can be effected by simple processes and facilities.

REFERENCES:
patent: 5068714 (1991-11-01), Seipler
patent: 5406459 (1995-04-01), Tsukamoto et al.
patent: 5407864 (1995-04-01), Kim
patent: 5611884 (1997-03-01), Bearinger et al.
"Multichip Module Technologies and Alternatives: The Basics", New York, Van Nostrand Reinhold, pp. 56-66 and 302-303 (1993).

Affiliated with

Also associated with

Rating

Chip connection structure having diret through-hole connections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip connection structure having diret through-hole connections , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip connection structure having diret through-hole connections will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1955233